OCP Busbar
ARIDA
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Overview
The mission of OCP is to enhance energy efficiency and achieve cost-effectiveness. Its initiatives have garnered significant attention from large enterprises and data center operators. The reason why large enterprises are only attracted by DC-MHS is that the latter can better control the hardware. By adopting a modular approach, large-scale data centers can easily manage and adjust their resources, smoothly expand the scale of their infrastructure to meet the increasing demands of their applications - this is crucial in today's era of generative AI and streaming services.
The M-HPM (Host Processor Module) workflow is designed to define and standardize the PCB/PCBA form factor (or HPM) within modular data center modules, enabling easy addition and reduction of components as needed. By achieving this, the M-HPM workflow significantly enhances data center flexibility and scalability, allowing smooth adaptation and expansion in modular data center environments.
The M-XIO / PESTI workflow consists of two parts. First, it defines the connector, pinout, and signal interface details for the Modular Expandable I/O (M-XIO) source connector, which serves as the entry and exit point between sources such as motherboards and HPMs and peripheral subsystems such as PCIe riser cards and backplanes.
The M-PIC workflow standardizes the components required to connect HPMs with platform and chassis infrastructure, including cooling, power distribution, and networking. As a result, M-PIC simplifies communication between modules, further improving resource efficiency and management, reducing operating costs, and enhancing overall performance in data center environments.
MST NearStack PCIe Connector System is part of the preferred extension for the M-PIC workflow.
The M-CRPS workflow specifies requirements for internal redundant power supplies, enabling standardization across data centers and vendors. By implementing common and redundant power supply designs, the M-CRPS workflow significantly improves overall stability and uptime of data center infrastructure, protecting critical operations from potential disruptions.
MST continues to invest in solutions that actively support DC-MHS. We will soon release a new CRPS connector specifically designed to meet the requirements of the M-CRPS workflow.
The M-SIF (Shared Infrastructure) workflow aims to improve interoperability for shared infrastructure enclosures that house multiple serviceable modules, including Host Processor Modules (HPMs), Data Center Storage and Compute Modules (DC-SCMs), and any peripheral devices. The goal is to facilitate live and hot-plug capabilities, enabling smooth insertion and removal of these modules without requiring precise alignment. As a result, the enclosure remains operational, ensuring uninterrupted data center performance.
Material Preparation – High-conductivity copper stock.
Stamping & Machining – Cut, punch, and machine to OCP specifications.
Plating – Nickel plating for oxidation resistance and stable contact.
Bending – Precise bending to fit power shelf or busway systems.
Inspection – Dimensional accuracy and surface quality verification.
| Parameter | Description |
|---|---|
| Material | Copper (C1100) |
| Plating | Nickel (standard) |
| Voltage | 48V DC (typical) |
| Applications | OCP-compliant power shelves, busway systems, rack power distribution |
| Standards | OCP specifications |
Rail Transit
Power Electronics
Communications & Data Sector
Photovoltaic Inverter
New Energy Electric Vehicle
Wind Power Converter
Inspect contact surfaces for oxidation or contamination.
Verify bolt torque to ensure low-resistance connections.
Keep busbars free from dust and debris in data center environments.
Q: What is OCP?
A: OCP (Open Compute Project) is an open-source initiative focused on designing efficient, scalable data center hardware.
Q: Why use 48V distribution?
A: 48V systems reduce power loss over distance and improve efficiency compared to 12V architectures.
Overview
The mission of OCP is to enhance energy efficiency and achieve cost-effectiveness. Its initiatives have garnered significant attention from large enterprises and data center operators. The reason why large enterprises are only attracted by DC-MHS is that the latter can better control the hardware. By adopting a modular approach, large-scale data centers can easily manage and adjust their resources, smoothly expand the scale of their infrastructure to meet the increasing demands of their applications - this is crucial in today's era of generative AI and streaming services.
The M-HPM (Host Processor Module) workflow is designed to define and standardize the PCB/PCBA form factor (or HPM) within modular data center modules, enabling easy addition and reduction of components as needed. By achieving this, the M-HPM workflow significantly enhances data center flexibility and scalability, allowing smooth adaptation and expansion in modular data center environments.
The M-XIO / PESTI workflow consists of two parts. First, it defines the connector, pinout, and signal interface details for the Modular Expandable I/O (M-XIO) source connector, which serves as the entry and exit point between sources such as motherboards and HPMs and peripheral subsystems such as PCIe riser cards and backplanes.
The M-PIC workflow standardizes the components required to connect HPMs with platform and chassis infrastructure, including cooling, power distribution, and networking. As a result, M-PIC simplifies communication between modules, further improving resource efficiency and management, reducing operating costs, and enhancing overall performance in data center environments.
MST NearStack PCIe Connector System is part of the preferred extension for the M-PIC workflow.
The M-CRPS workflow specifies requirements for internal redundant power supplies, enabling standardization across data centers and vendors. By implementing common and redundant power supply designs, the M-CRPS workflow significantly improves overall stability and uptime of data center infrastructure, protecting critical operations from potential disruptions.
MST continues to invest in solutions that actively support DC-MHS. We will soon release a new CRPS connector specifically designed to meet the requirements of the M-CRPS workflow.
The M-SIF (Shared Infrastructure) workflow aims to improve interoperability for shared infrastructure enclosures that house multiple serviceable modules, including Host Processor Modules (HPMs), Data Center Storage and Compute Modules (DC-SCMs), and any peripheral devices. The goal is to facilitate live and hot-plug capabilities, enabling smooth insertion and removal of these modules without requiring precise alignment. As a result, the enclosure remains operational, ensuring uninterrupted data center performance.
Material Preparation – High-conductivity copper stock.
Stamping & Machining – Cut, punch, and machine to OCP specifications.
Plating – Nickel plating for oxidation resistance and stable contact.
Bending – Precise bending to fit power shelf or busway systems.
Inspection – Dimensional accuracy and surface quality verification.
| Parameter | Description |
|---|---|
| Material | Copper (C1100) |
| Plating | Nickel (standard) |
| Voltage | 48V DC (typical) |
| Applications | OCP-compliant power shelves, busway systems, rack power distribution |
| Standards | OCP specifications |
Rail Transit
Power Electronics
Communications & Data Sector
Photovoltaic Inverter
New Energy Electric Vehicle
Wind Power Converter
Inspect contact surfaces for oxidation or contamination.
Verify bolt torque to ensure low-resistance connections.
Keep busbars free from dust and debris in data center environments.
Q: What is OCP?
A: OCP (Open Compute Project) is an open-source initiative focused on designing efficient, scalable data center hardware.
Q: Why use 48V distribution?
A: 48V systems reduce power loss over distance and improve efficiency compared to 12V architectures.
